Product Function Introduction:
Powerful spatial dispensing trajectory movement ability, CCD grab the product profile, automatically calculate the product center position and correct the compensation amount of each axis of motion. Through the cooperation of multi-axis system, it can realize the complex movement trajectory, meanwhile drive the dispensing control system to dispense glue automatically, the glue is sprayed with accurate angle and path, at present, it is maturely applied with two kinds of piezoelectric valves and needle contact dispensing, both dispensing modes can realize the precise control of the glue weight, higher aspect ratio, and other core parameter requirements.
Product features and applicable scenes:
1. Able to adapt to a variety of complex structure of the product
2. Able to control the spraying position and flow of glue, thus ensuring the accuracy and consistency of the product.
3. Able to adjust dispensing parameters automatically according to environmental changes in real time to ensure the stability and efficiency of the dispensing process 4. CCD positioning and detection system to achieve the glue width detection is widely used in the field of cell phone full-screen small round holes, the glass end face of the cell phone shaped screen dispensing, coating, as well as TP, LCM gap filling, etc.
Product Features:
Desktop dispenser has the advantages of high precision, flexibility, simple operation, easy maintenance and high cost performance, which can meet the dispensing operation in different fields and production needs, and is a very practical and efficient dispensing equipment.
Applicable Scene:
Apply to PCB electronic parts fixing and protection, cell phone, notebook shell bonding, LCD glass, LED dispensing, dual camera dispensing and encapsulation, fingerprint module dispensing, automotive parts coating, chip binding, battery encapsulation, speaker dispensing, SMT bottom filling, component encapsulation, dispensing solder paste, dispensing red adhesive, dispensing black adhesive, semiconductor encapsulation, wafer fixing and so on.